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Stock: In Stock
Shipping Method: LCL, AIR, FCL, Express
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Category: |
Integrated Circuits (ICs)
Embedded
System On Chip (SoC) |
Base Product Number: |
XC7Z007 |
Product Status: |
Active |
Peripherals: |
DMA |
Primary Attributes: |
Artix™-7 FPGA, 23K Logic Cells |
Series: |
Zynq®-7000 |
Package: |
Tray |
Mfr: |
AMD |
Supplier Device Package: |
225-CSPBGA (13x13) |
Connectivity: |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operating Temperature: |
-40°C ~ 100°C (TJ) |
Architecture: |
MCU, FPGA |
Package / Case: |
225-LFBGA, CSPBGA |
Number of I/O: |
54 |
RAM Size: |
256KB |
Speed: |
766MHz |
Core Processor: |
Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: |
- |
Category: |
Integrated Circuits (ICs)
Embedded
System On Chip (SoC) |
Base Product Number: |
XC7Z007 |
Product Status: |
Active |
Peripherals: |
DMA |
Primary Attributes: |
Artix™-7 FPGA, 23K Logic Cells |
Series: |
Zynq®-7000 |
Package: |
Tray |
Mfr: |
AMD |
Supplier Device Package: |
225-CSPBGA (13x13) |
Connectivity: |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operating Temperature: |
-40°C ~ 100°C (TJ) |
Architecture: |
MCU, FPGA |
Package / Case: |
225-LFBGA, CSPBGA |
Number of I/O: |
54 |
RAM Size: |
256KB |
Speed: |
766MHz |
Core Processor: |
Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: |
- |
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